Invention Grant
US08013394B2 Integrated circuit having resistor between BEOL interconnect and FEOL structure and related method
有权
具有BEOL互连和FEOL结构之间的电阻的集成电路及相关方法
- Patent Title: Integrated circuit having resistor between BEOL interconnect and FEOL structure and related method
- Patent Title (中): 具有BEOL互连和FEOL结构之间的电阻的集成电路及相关方法
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Application No.: US11692336Application Date: 2007-03-28
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Publication No.: US08013394B2Publication Date: 2011-09-06
- Inventor: Anil K Chinthakindi , Vincent J McGahay
- Applicant: Anil K Chinthakindi , Vincent J McGahay
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Joseph J. Petrokaitis
- Main IPC: H01L23/62
- IPC: H01L23/62 ; H01L21/20
Abstract:
Integrated circuits (IC) and a method of fabricating an IC, where the structure of the IC incorporates a back-end-of-the-line (BEOL) thin film resistor below a first metal layer to achieve lower topography are disclosed. The resistor directly contacts any one of: a contact metal in the front-end-of-the-line (FEOL) structure; first metal layer in the BEOL interconnect; or the combination thereof, to avoid the necessity of forming contacts with differing heights or contacts over varying topography.
Public/Granted literature
- US20080237800A1 INTEGRATED CIRCUIT HAVING RESISTOR BETWEEN BEOL INTERCONNECT AND FEOL STRUCTURE AND RELATED METHOD Public/Granted day:2008-10-02
Information query
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