Invention Grant
- Patent Title: Low cost substrates and method of forming such substrates
- Patent Title (中): 低成本基板和形成这种基板的方法
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Application No.: US12469436Application Date: 2009-05-20
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Publication No.: US08013417B2Publication Date: 2011-09-06
- Inventor: Bich-Yen Nguyen , Carlos Mazure
- Applicant: Bich-Yen Nguyen , Carlos Mazure
- Applicant Address: FR Bernin
- Assignee: S.O.I.T.ec Silicon on Insulator Technologies
- Current Assignee: S.O.I.T.ec Silicon on Insulator Technologies
- Current Assignee Address: FR Bernin
- Agency: Winston & Strawn LLP
- Priority: FR0803701 20080630
- Main IPC: H01L21/70
- IPC: H01L21/70
Abstract:
In one embodiment, the invention provides engineered substrates having a support with surface pits, an intermediate layer of amorphous material arranged on the surface of the support so as to at least partially fill the surface pits, and a top layer arranged on the intermediate layer. The invention also provides methods for manufacturing the engineered substrates which deposit an intermediate layer on a pitted surface of a support so as to at least partially fill the surface pits, then anneal the intermediate layer, then assemble a donor substrate with the annealed intermediate layer to form an intermediate structure, and finally reduce the thickness of the donor substrate portion of the intermediate structure in order to form the engineered substrate.
Public/Granted literature
- US20090321872A1 LOW COST SUBSTRATES AND METHOD OF FORMING SUCH SUBSTRATES Public/Granted day:2009-12-31
Information query
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