Invention Grant
- Patent Title: Air cavity package with copper heat sink and ceramic window frame
- Patent Title (中): 气腔封装带铜散热器和陶瓷窗框
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Application No.: US12502440Application Date: 2009-07-14
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Publication No.: US08013429B2Publication Date: 2011-09-06
- Inventor: Anwar A. Mohammed , Soon Ing Chew , Alexander Komposch , Christian Andrada
- Applicant: Anwar A. Mohammed , Soon Ing Chew , Alexander Komposch , Christian Andrada
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Coats & Bennett, P.L.L.C.
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the copper heat sink so that the bead of epoxy generally surrounds the die and placing a ceramic window frame on the bead of epoxy. The epoxy is cured to attach a bottom surface of the ceramic window frame to the copper heat sink.
Public/Granted literature
- US20110012254A1 Air Cavity Package with Copper Heat Sink and Ceramic Window Frame Public/Granted day:2011-01-20
Information query
IPC分类:
