An interconnect structure is provided that has enhanced electromigration reliability without degrading circuit short yield, and improved technology extendibility. The inventive interconnect structure includes a dielectric material having a dielectric constant of about 3.0 or less. The dielectric material has at least one conductive material embedded therein. A nitrogen-containing noble metal cap is located predominately (i.e., essentially) on an upper surface of the at least one conductive region. The nitrogen-containing noble metal cap does not extend onto an upper surface of the dielectric material. In some embodiments, the nitrogen-containing noble metal cap is self-aligned to the embedded conductive material, while in other embodiments some portion of the nitrogen-containing noble metal cap extends onto an upper surface of a diffusion barrier that separates the at least one conductive material from the dielectric material. A method of fabricating such an interconnect structure utilizing a low temperature (about 200° C. or less) chemical deposition process is also provided.