Invention Grant
- Patent Title: Semiconductor component with terminal contact surface
- Patent Title (中): 具有端子接触面的半导体元件
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Application No.: US12529911Application Date: 2008-01-21
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Publication No.: US08013450B2Publication Date: 2011-09-06
- Inventor: Rainer Minixhofer , Verena Vescoli
- Applicant: Rainer Minixhofer , Verena Vescoli
- Applicant Address: AT Unterpremstätten
- Assignee: austriamicrosystems AG
- Current Assignee: austriamicrosystems AG
- Current Assignee Address: AT Unterpremstätten
- Agency: Cozen O'Connor
- Priority: DE102007011126 20070307
- International Application: PCT/EP2008/050642 WO 20080121
- International Announcement: WO2008/107216 WO 20080912
- Main IPC: H01L23/52
- IPC: H01L23/52

Abstract:
At least one terminal contact surface (1) is formed on a topmost metal plane (2). Under it, in a secondmost metal plane (3), is a reinforcement region (8), in which the secondmost metal plane (3) is structured within its two-dimensional extent such that a part of the area of the vertical (with respect to the metal plane) projection of the terminal contact surface (1) onto the secondmost metal plane (3) that is occupied by the metal of the secondmost metal plane (3) amounts to at least one third of the area.
Public/Granted literature
- US20100276811A1 Semiconductor Component with Terminal Contact Surface Public/Granted day:2010-11-04
Information query
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