Invention Grant
- Patent Title: Molded beam for optoelectronic sensor chip substrate
- Patent Title (中): 用于光电传感器芯片基板的模制光束
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Application No.: US12032805Application Date: 2008-02-18
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Publication No.: US08013456B2Publication Date: 2011-09-06
- Inventor: Robert S. Stricklin
- Applicant: Robert S. Stricklin
- Applicant Address: US TX Plano
- Assignee: Texas Advanced Optoelectronic Solutions, Inc.
- Current Assignee: Texas Advanced Optoelectronic Solutions, Inc.
- Current Assignee Address: US TX Plano
- Agency: Howison & Arnott, L.L.P.
- Main IPC: H01L23/29
- IPC: H01L23/29

Abstract:
A substrate on which a plurality of epoxy over molded integrated circuit dies are formed includes a beam formed on the substrate for providing stiffness to the substrate. The beam includes structure having a cross-sectional shape, for example, substantially in the shape of a trapezoid, “T” or “L”, and may be formed on the top or bottom surface of the substrate.
Public/Granted literature
- US20080224334A1 Molded Beam for Optoelectronic Sensor Chip Substrate Public/Granted day:2008-09-18
Information query
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