Invention Grant
- Patent Title: Cooling apparatus
- Patent Title (中): 冷却装置
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Application No.: US12125942Application Date: 2008-05-23
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Publication No.: US08013484B2Publication Date: 2011-09-06
- Inventor: Chih-Hao Yang , Che-Cheng Hu
- Applicant: Chih-Hao Yang , Che-Cheng Hu
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200710200708 20070525
- Main IPC: H02K9/00
- IPC: H02K9/00

Abstract:
A cooling apparatus is for dissipating heat from an electronic device. The cooling apparatus includes a casing, an impeller, and a motor. The casing is for absorbing the heat and allowing coolant to flow therein. The impeller is received in the casing. The motor is received in the casing, and is for providing a force to drive the impeller to rotate to force the coolant to flow. The coolant flows between the casing and the motor to take the heat away.
Public/Granted literature
- US20080289803A1 COOLING APPARATUS Public/Granted day:2008-11-27
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