Invention Grant
US08013709B2 Conductive module and assembly structure having such conductive module
有权
具有这种导电模块的导电模块和组装结构
- Patent Title: Conductive module and assembly structure having such conductive module
- Patent Title (中): 具有这种导电模块的导电模块和组装结构
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Application No.: US12714441Application Date: 2010-02-27
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Publication No.: US08013709B2Publication Date: 2011-09-06
- Inventor: Sheng-Nan Tsai , Yi-Fan Wu , Yung-Sheng Yeh , Jia-Li Tsai , Chia-Cheng Yang , Yung-Yu Chang , Tsung-Sheng Yeh , Hua-Sheng Lin , Chun-Yu Hou , Tsung-Hsiao Wu
- Applicant: Sheng-Nan Tsai , Yi-Fan Wu , Yung-Sheng Yeh , Jia-Li Tsai , Chia-Cheng Yang , Yung-Yu Chang , Tsung-Sheng Yeh , Hua-Sheng Lin , Chun-Yu Hou , Tsung-Hsiao Wu
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Priority: TW97114256A 20080418
- Main IPC: H01F27/30
- IPC: H01F27/30 ; H01F27/06 ; H01F21/06 ; H01F21/04 ; H01F27/28

Abstract:
The present invention provides a conductive module used for assembling a magnetic element and an electronic component. The conductive module includes a conductive base, an electronic component and a plurality of conductive units. The electronic component is electrically connected to the conductive base and disposed on one side of the conductive base. The conductive units have respective hollow portions. The conductive units are spaced from each other and fixed on the conductive base such that the hollow portions of the conductive units are aligned with each other to define a channel.
Public/Granted literature
- US20100188830A1 CONDUCTIVE MODULE AND ASSEMBLY STRUCTURE HAVING SUCH CONDUCTIVE MODULE Public/Granted day:2010-07-29
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