Invention Grant
- Patent Title: Magnetic element module
- Patent Title (中): 磁性元件模块
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Application No.: US12845394Application Date: 2010-07-28
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Publication No.: US08013710B2Publication Date: 2011-09-06
- Inventor: Yu-Chun Lai , Po-Yu Wei
- Applicant: Yu-Chun Lai , Po-Yu Wei
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Kirton & McConkie
- Agent Evan R. Witt
- Priority: TW98125993A 20090731
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F27/28

Abstract:
A magnetic element module includes a magnetic core assembly and at least one first winding structure. The magnetic core assembly includes a first magnetic core and a second magnetic core. The first magnetic core includes a first magnetic slab and a first magnetic post. The second magnetic core includes a second magnetic slab and a second magnetic post. The first winding structure is sheathed around the first magnetic post. The first magnetic post is placed on a second edge of the second magnetic slab. The second magnetic post is placed on a first edge of the first magnetic slab. The first magnetic core, the second magnetic core and the first winding structure are combined together, thereby producing the magnetic element module.
Public/Granted literature
- US20110025445A1 MAGNETIC ELEMENT MODULE Public/Granted day:2011-02-03
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