Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US12289727Application Date: 2008-11-03
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Publication No.: US08014103B2Publication Date: 2011-09-06
- Inventor: Tetsuya Ohsawa , Toshiki Naito , Hirotoshi Iguchi
- Applicant: Tetsuya Ohsawa , Toshiki Naito , Hirotoshi Iguchi
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2007-289804 20071107
- Main IPC: G11B5/48
- IPC: G11B5/48 ; G11B5/60 ; G11B21/21
Abstract:
A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive layer formed on the insulating layer, and a pedestal for supporting a slider. The pedestal includes a lower pedestal made of the insulating layer, and formed in a continuous frame shape so as to surround a bonding surface of the metal supporting board to the slider, and an upper pedestal made of the conductive layer, and formed in a discontinuous frame shape on the lower pedestal.
Public/Granted literature
- US20090116150A1 Suspension board with circuit Public/Granted day:2009-05-07
Information query
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