Invention Grant
- Patent Title: Suspension device
- Patent Title (中): 悬挂装置
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Application No.: US11900567Application Date: 2007-09-12
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Publication No.: US08014107B2Publication Date: 2011-09-06
- Inventor: Kouichi Toukairin , Hirofumi Suzuki , Osamu Kajitani , Noriyuki Saito , Hideki Kashima , Tsukasa Higashi
- Applicant: Kouichi Toukairin , Hirofumi Suzuki , Osamu Kajitani , Noriyuki Saito , Hideki Kashima , Tsukasa Higashi
- Applicant Address: JP Yokohama-Shi JP Tokyo
- Assignee: NHK Spring Co., Ltd.,Toshiba Storage Device Corporation
- Current Assignee: NHK Spring Co., Ltd.,Toshiba Storage Device Corporation
- Current Assignee Address: JP Yokohama-Shi JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2006-248437 20060913
- Main IPC: G11B5/60
- IPC: G11B5/60 ; G11B21/21

Abstract:
A suspension device including a flexure with conductors is provided with an anti-ESD section. The anti-ESD section includes a metal plate, a insulating layer, a first electrically conductive member formed of a pair of read conductors, a second electrically conductive member formed of a pair of write conductors, a heater conductor, semiconductive layers, etc. The semiconductive layers are grounded to the metal plate and electrically isolated from one another by an insulating portion.
Public/Granted literature
- US20080062567A1 Suspension device Public/Granted day:2008-03-13
Information query
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