Invention Grant
- Patent Title: Electronic device assembly
- Patent Title (中): 电子设备组装
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Application No.: US12607979Application Date: 2009-10-28
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Publication No.: US08014134B2Publication Date: 2011-09-06
- Inventor: Bao-Shuai Liu , Yung-Hung Chu
- Applicant: Bao-Shuai Liu , Yung-Hung Chu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810305653 20081120
- Main IPC: H05K5/03
- IPC: H05K5/03

Abstract:
An electronic device assembly comprises a protecting panel an electronic device, which comprises a shell with a front cover and a back cover and a display panel received in the shell. A plurality of sliding grooves is opened in the shell and extends from the front cover to the back cover. The protective cover is slidably set in the sliding grooves so as to cover the display panel in a first state or expose the display panel in a second state.
Public/Granted literature
- US20100124003A1 ELECTRONIC DEVICE ASSEMBLY Public/Granted day:2010-05-20
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