Invention Grant
- Patent Title: Fan module for electronic device
- Patent Title (中): 风扇模块用于电子设备
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Application No.: US12607957Application Date: 2010-01-19
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Publication No.: US08014149B2Publication Date: 2011-09-06
- Inventor: Ifeng Hsu , Jenq-Haur Pan , Chang-Yuan Wu
- Applicant: Ifeng Hsu , Jenq-Haur Pan , Chang-Yuan Wu
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A fan module is disposed in an electrical device. The electrical device has a main board and a casing. The fan module includes a vane module, a fan motor, a circuit board and a fan housing. The vane module has a hub and a plurality of vanes disposed around the edge of the hub. The fan motor is disposed in the hub. The circuit board is used to control the fan motor, so that the vanes rotate related to an axis of the hub for generating an air flow. The fan housing has a main body portion, a protruding portion and a fixing portion, wherein the protruding portion is located in a side of the main body portion, the vane module and the fan motor are disposed in the main body portion and the circuit board is disposed in the protruding portion.
Public/Granted literature
- US20100128435A1 FAN MODULE FOR ELECTRONIC DEVICE Public/Granted day:2010-05-27
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