Invention Grant
- Patent Title: Housing structure and electronic apparatus having the same
- Patent Title (中): 外壳结构和具有相同的电子设备
-
Application No.: US11707261Application Date: 2007-02-16
-
Publication No.: US08014155B2Publication Date: 2011-09-06
- Inventor: Masaki Kanayama , Mitsuhiko Kawami , Hisao Morooka
- Applicant: Masaki Kanayama , Mitsuhiko Kawami , Hisao Morooka
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Main IPC: H05K5/00
- IPC: H05K5/00
Abstract:
A housing accommodates a circuit board and an electronic component electrically connected to the circuit board, and is used for an electronic apparatus that includes the circuit board and the electronic component. The housing includes a cover that is made by extrusion molding of metal.
Public/Granted literature
- US20070184727A1 Housing structure and electronic apparatus having the same Public/Granted day:2007-08-09
Information query
