The present invention relates to a package module for a memory IC chip, in which first solder pads provided on an upper surface of the memory IC chip is electrically connected to lower contact pads provided on the periphery of the ground pad, lower contact pads is soldered upward with lead frames and upper contact pads, and lastly a molding layer is used for packaging and enclosing the above elements, while only exposing the lower contact pads and the upper contact pads. Therefore, it will facilitate that each of upper contact pads of a lower layer is correspondingly soldered to one of lower contact pads of an upper layer as the upper layer and the lower layer are stacked together. Thus, it is capable of obtain high acceptable production yield, while accomplishing the object of expanding the memory capacity in total when stacking the layers of the package structure.