Invention Grant
- Patent Title: Stacking integrated circuits containing serializer and deserializer blocks using through silicon via
- Patent Title (中): 通过硅通孔堆叠包含串行器和解串器块的集成电路
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Application No.: US12205875Application Date: 2008-09-06
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Publication No.: US08014166B2Publication Date: 2011-09-06
- Inventor: Farhang Yazdani
- Applicant: Farhang Yazdani
- Applicant Address: US NV Las Vegas
- Assignee: Broadpak Corporation
- Current Assignee: Broadpak Corporation
- Current Assignee Address: US NV Las Vegas
- Agency: Maxvalueip, LLC
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
Methods and systems for stacking multiple chips with high speed serialiser/deserialiser blocks are presented. These methods make use of Through Silicon Via (TSV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serialiser/deserialiser blocks, using the TSVs.
Public/Granted literature
- US20100058580A1 Stacking Integrated Circuits containing Serializer and Deserializer Blocks using Through Silicon Via Public/Granted day:2010-03-11
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