Invention Grant
- Patent Title: Telecommunications patching systems with high density patching modules
- Patent Title (中): 具有高密度补丁模块的电信修补系统
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Application No.: US12359542Application Date: 2009-01-26
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Publication No.: US08014646B2Publication Date: 2011-09-06
- Inventor: Scott Martin Keith , G. Mabud Choudhury , Chin Choi-Feng , Gary E. Grimes
- Applicant: Scott Martin Keith , G. Mabud Choudhury , Chin Choi-Feng , Gary E. Grimes
- Applicant Address: US NC Hickory
- Assignee: CommScope, Inc. of North Carolina
- Current Assignee: CommScope, Inc. of North Carolina
- Current Assignee Address: US NC Hickory
- Agency: Myers Bigel Sibley & Sajovec
- Main IPC: G02B6/00
- IPC: G02B6/00

Abstract:
A telecommunications patching system includes: a generally horizontal main panel; a row of front connectors associated with the main panel, each of the front connectors being spaced apart from immediately adjacent front connectors by a gap; and a row of rear connectors associated with the main panel, each of the rear connectors being spaced apart from immediately adjacent rear connectors by a gap. The front connectors are laterally offset from the rear connectors such that each of the gaps between the rear connectors aligns with a respective front connector, and each of the gaps between the front connectors aligns with a respective rear connector. In this configuration, cords or cables connected with the front row of connectors can reside in the gaps between the rear connectors, and cords or cable with the rear connectors can reside in the gaps between the front connectors. This arrangement can provide high port density to the patching system.
Public/Granted literature
- US20100189403A1 Telecommunications Patching Systems with High Density Patching Modules Public/Granted day:2010-07-29
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