Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US12224858Application Date: 2007-03-13
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Publication No.: US08014887B2Publication Date: 2011-09-06
- Inventor: Masako Sueyoshi , Kazuhito Saito
- Applicant: Masako Sueyoshi , Kazuhito Saito
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-078561 20060322
- International Application: PCT/JP2007/055004 WO 20070313
- International Announcement: WO2007/108370 WO 20070927
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05B11/01 ; G05B15/00 ; G08B25/00 ; G08B23/00

Abstract:
A substrate processing apparatus includes an operating section. The operating section includes a display unit having an operation screen, a screen file that stores daily check data monitor screen data in which a row number is settable as a data number, and a data name is settable as item data of a daily check. The operating section further includes a daily check initial parameter file that stores parameter data corresponding to the item data. The operating section displays the daily check data monitor screen data by extracting the screen file and placing the daily check data monitor screen data on the operation screen as a daily check data monitor screen, and by extracting the daily check initial parameter file, searching through the daily check initial parameter file based on the data number, and placing parameter data corresponding to the item data on the operation screen as the daily check data monitor screen.
Public/Granted literature
- US20090024238A1 Substrate Processing Apparatus Public/Granted day:2009-01-22
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