Invention Grant
- Patent Title: Method for manufacturing a high-frequency assembly
- Patent Title (中): 制造高频组件的方法
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Application No.: US10573698Application Date: 2004-09-09
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Publication No.: US08014890B2Publication Date: 2011-09-06
- Inventor: Willibald Konrath , Haiko Schmelcher
- Applicant: Willibald Konrath , Haiko Schmelcher
- Applicant Address: SE Stockholm
- Assignee: Ericsson AB
- Current Assignee: Ericsson AB
- Current Assignee Address: SE Stockholm
- Agency: Coats & Bennett, P.L.L.C.
- Priority: DE10344409 20030925
- International Application: PCT/EP2004/052116 WO 20040909
- International Announcement: WO2005/032221 WO 20050407
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency-specific component (12, 30) a feature (23, 24) which encodes the frequency is looked for. The specimen is built in if the feature (23, 24; 26) is found in the specimen and is judged to be correct; otherwise the specimen is rejected.
Public/Granted literature
- US20070208449A1 Method For Manufacturing A High-Frequency Assembly Public/Granted day:2007-09-06
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