Invention Grant
US08014890B2 Method for manufacturing a high-frequency assembly 有权
制造高频组件的方法

Method for manufacturing a high-frequency assembly
Abstract:
In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency-specific component (12, 30) a feature (23, 24) which encodes the frequency is looked for. The specimen is built in if the feature (23, 24; 26) is found in the specimen and is judged to be correct; otherwise the specimen is rejected.
Public/Granted literature
Information query
Patent Agency Ranking
0/0