Invention Grant
- Patent Title: Temperature setting method of heat processing plate, temperature setting apparatus of heat processing plate, program, and computer-readable recording medium recording program thereon
- Patent Title (中): 热处理板的温度设定方法，加热板温度调节装置，程序和计算机可读记录介质记录程序
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Application No.: US11721612Application Date: 2005-12-07
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Publication No.: US08014895B2Publication Date: 2011-09-06
- Inventor: Shuji Iwanaga , Nobuyuki Sata
- Applicant: Shuji Iwanaga , Nobuyuki Sata
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-360064 20041213
- International Application: PCT/JP2005/022454 WO 20051207
- International Announcement: WO2006/064697 WO 20060622
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05D23/00 ; H01L21/20 ; H01L21/44 ; H01L21/265 ; H01L21/425 ; H01L21/00 ; H01L21/469 ; H05B6/10 ; H05B3/68 ; F27D11/00 ; F27D5/00 ; F27D13/00 ; C10B21/20 ; F27D15/02
Abstract:
An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.
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