Invention Grant
US08015511B2 Adjustment of mask shapes for improving printability of dense integrated circuit layout
有权
调整面罩形状,提高密集集成电路布局的可印刷性
- Patent Title: Adjustment of mask shapes for improving printability of dense integrated circuit layout
- Patent Title (中): 调整面罩形状,提高密集集成电路布局的可印刷性
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Application No.: US12348331Application Date: 2009-01-05
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Publication No.: US08015511B2Publication Date: 2011-09-06
- Inventor: Azalia Krasnoperova , Ian P Stobert , Klaus Herold
- Applicant: Azalia Krasnoperova , Ian P Stobert , Klaus Herold
- Applicant Address: US NY Armonk US CA Milpitas
- Assignee: International Business Machines Corporation,InfineonTechnologies North America Corporation
- Current Assignee: International Business Machines Corporation,InfineonTechnologies North America Corporation
- Current Assignee Address: US NY Armonk US CA Milpitas
- Agent Yuanmin Cai
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Embodiments of the present invention provide a method for making mask shape adjustment The method includes creating a first mask shape; identifying one or more mask segments of the first mask shape as candidate mask segments of needing segment adjustment; applying an optical proximity correction (OPC) process to the first mask shape, the OPC process identifying at least one of the candidate mask segments as a constrained mask segment; applying a rotational adjustment to the constrained mask segment; and creating a second mask shape having the constrained mask segment being rotationally adjusted. A system and a machine-readable medium for performing the above method are also provided.
Public/Granted literature
- US20100175041A1 ADJUSTMENT OF MASK SHAPES FOR IMPROVING PRINTABILITY OF DENSE INTEGRATED CIRCUIT LAYOUT Public/Granted day:2010-07-08
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