A method of generating a scalable OPC model for composing reticle pattern files from IC layouts using 2D test patterns is disclosed. The 2D test patterns include basic features which replicate features found in advanced ICs. Variations of feature dimensions and structure pitches provide measurement data which enables the scalability of the OPC model. A method of checking reticle pattern files for features which cannot be modeled by the scalable OPC model is also disclosed.