Invention Grant
US08015538B2 Design structure with a deep sub-collector, a reach-through structure and trench isolation
有权
具有深子集电极的设计结构,通孔结构和沟槽隔离
- Patent Title: Design structure with a deep sub-collector, a reach-through structure and trench isolation
- Patent Title (中): 具有深子集电极的设计结构,通孔结构和沟槽隔离
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Application No.: US11941104Application Date: 2007-11-16
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Publication No.: US08015538B2Publication Date: 2011-09-06
- Inventor: Douglas D Coolbaugh , Xuefeng Liu , Robert M. Rassel , David C. Sheridan , Steven H. Voldman
- Applicant: Douglas D Coolbaugh , Xuefeng Liu , Robert M. Rassel , David C. Sheridan , Steven H. Voldman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony J. Canale
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F11/22 ; G06F9/455 ; H01L29/00 ; H01L21/8238 ; H01L21/20

Abstract:
The invention relates to noise isolation in semiconductor devices, and a design structure on which a subject circuit resides. A design structure is embodied in a machine readable medium used in a design process. The design structure includes a deep sub-collector located in a first epitaxial layer, and a doped region located in a second epitaxial layer, which is above the first epitaxial layer. The design structure further includes a reach-through structure penetrating from a surface of the device through the first and second epitaxial layers to the deep sub-collector, and a trench isolation structure penetrating from a surface of the device and surrounding the doped region.
Public/Granted literature
- US20080092094A1 SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE Public/Granted day:2008-04-17
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