Invention Grant
US08017289B2 Method for manufacturing a surface and integrated circuit using variable shaped beam lithography 有权
使用可变形光束光刻制造表面和集成电路的方法

  • Patent Title: Method for manufacturing a surface and integrated circuit using variable shaped beam lithography
  • Patent Title (中): 使用可变形光束光刻制造表面和集成电路的方法
  • Application No.: US12987994
    Application Date: 2011-01-10
  • Publication No.: US08017289B2
    Publication Date: 2011-09-13
  • Inventor: Akira FujimuraLance Glasser
  • Applicant: Akira FujimuraLance Glasser
  • Applicant Address: US CA San Jose
  • Assignee: D2S, Inc.
  • Current Assignee: D2S, Inc.
  • Current Assignee Address: US CA San Jose
  • Main IPC: G03F9/00
  • IPC: G03F9/00 G03C5/00
Method for manufacturing a surface and integrated circuit using variable shaped beam lithography
Abstract:
A method is disclosed in which a plurality of variable shaped beam (VSB) shots is used to form a desired pattern on a surface. In this method some shots within the plurality of shots overlap each other. Additionally, the union of any subset of the plurality of shots differ from the desired pattern. In some embodiments, dosages of the shots vary with respect to each other. In other embodiments, an optimization technique may be used to minimize shot count. In yet other embodiments, the plurality of shots may be optionally selected from one or more pre-computed VSB shots or groups of VSB shots. The method of the present disclosure may be used, for example, in the process of manufacturing an integrated circuit by optical lithography using a reticle, or in the process of manufacturing an integrated circuit using direct write.
Information query
Patent Agency Ranking
0/0