Invention Grant
- Patent Title: Heat-conductive adhesive
- Patent Title (中): 导热胶
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Application No.: US12373013Application Date: 2007-07-27
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Publication No.: US08017674B2Publication Date: 2011-09-13
- Inventor: Hiroki Sano , Hiroshi Hara , Tatsuichiro Kon
- Applicant: Hiroki Sano , Hiroshi Hara , Tatsuichiro Kon
- Applicant Address: JP Osaka
- Assignee: Teijin Limited
- Current Assignee: Teijin Limited
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-206181 20060728; JP2006-206182 20060728; JP2006-230429 20060828
- International Application: PCT/JP2007/064736 WO 20070727
- International Announcement: WO2008/013252 WO 20080131
- Main IPC: C08J5/04
- IPC: C08J5/04
Abstract:
The invention provides a heat-conductive adhesive with high heat spread properties and excellent handleability. A pitch-based carbon fiber filler with high thermal conductivity and a smooth surface is combined with an adhesive resin to produce a heat-conductive adhesive with controlled viscosity and excellent handleability.
Public/Granted literature
- US20090250655A1 HEAT-CONDUCTIVE ADHESIVE Public/Granted day:2009-10-08
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