This invention relates to an epoxy resin composition which has better adhesive performance and flexibility at low temperatures (about −20° C.) to normal temperature as well as elevated temperatures (about 80° C.) and is suitable for use as a structural adhesive. The epoxy resin composition includes 100 mass parts epoxy resin, 5 to 100 mass parts core-shell particles, and a curing agent. 1 to 50 mass % of the epoxy resin is a urethane-modified epoxy resin and the core-shell particles include acrylonitrile in the monomer used during the production of the shell layer, and/or comprise a structure having at least three layers of a core layer, an interlayer, and a shell layer.