Invention Grant
- Patent Title: High-frequency heating apparatus
- Patent Title (中): 高频加热装置
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Application No.: US10599961Application Date: 2005-04-22
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Publication No.: US08017893B2Publication Date: 2011-09-13
- Inventor: Haruo Suenaga , Hideaki Moriya , Shinichi Sakai , Hisashi Morikawa , Toyotsugu Matsukura , Nobuo Shirokawa
- Applicant: Haruo Suenaga , Hideaki Moriya , Shinichi Sakai , Hisashi Morikawa , Toyotsugu Matsukura , Nobuo Shirokawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2004-132640 20040428
- International Application: PCT/JP2005/007697 WO 20050422
- International Announcement: WO2005/107326 WO 20051110
- Main IPC: H05B6/64
- IPC: H05B6/64

Abstract:
A purpose of the present invention is to provide an inverter circuit capable of suppressing an overshooting phenomenon of an input current at an instantaneous time when an initiating operation of the inverter circuit is switched to the normal operation thereof, and thus, capable of preventing damages of IGBTs and a magnetron.In a high frequency heating apparatus comprising: a control signal forming circuit for forming a control signal from a difference between an input current of an AC power supply and a reference current; a frequency modulated signal forming circuit for correcting rectified voltage/rectified current which are obtained by rectifying the AC voltage/current of the AC power supply based upon the control signal of the control signal forming circuit; and a dead time forming circuit for receiving the output of the frequency modulated signal forming circuit, a control signal converting circuit having a function capable of further lowering the value of the control signal is provided between the control signal forming circuit and the frequency modulated signal forming circuit.
Public/Granted literature
- US20080272115A1 High-Frequency Heating Apparatus Public/Granted day:2008-11-06
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