Invention Grant
- Patent Title: Light-emitting element including a fusion-bonding portion on contact electrodes
- Patent Title (中): 发光元件包括在接触电极上的熔接部分
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Application No.: US12155820Application Date: 2008-06-10
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Publication No.: US08017967B2Publication Date: 2011-09-13
- Inventor: Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
- Applicant: Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
- Applicant Address: JP Nishikasugai-gun, Aichi-ken
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Nishikasugai-gun, Aichi-ken
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2004-263097 20040909; JP2004-316007 20041029
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.
Public/Granted literature
- US20080252212A1 Solid state device and light-emitting element Public/Granted day:2008-10-16
Information query
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