Invention Grant
- Patent Title: Electrostatic discharge protection pattern for high voltage applications
- Patent Title (中): 用于高压应用的静电放电保护模式
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Application No.: US12046216Application Date: 2008-03-11
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Publication No.: US08018000B2Publication Date: 2011-09-13
- Inventor: Shui-Hung Chen , Jian-Hsing Lee , Yung-Tien Tsai , Anthony Oates
- Applicant: Shui-Hung Chen , Jian-Hsing Lee , Yung-Tien Tsai , Anthony Oates
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
Electrostatic discharge (ESD) protection in high voltage semiconductor devices is disclosed that provides enhanced current isolation between transistor drains or sources by creating an isolation island surrounding the drains or sources. This isolation island can be a higher-doped region within which the drain/source lies. The junction between the higher doping of this island region and the surrounding substrates operates to limit the amount of current that passes through the drain/source. Additionally, oxide features may be used to create an island surrounding the drain/source contact. Again, this isolating effect makes the amount of current passing through the device more uniform, which protects the device from damage due to an ESD event.
Public/Granted literature
- US20090179270A1 Electrostatic Discharge Protection Pattern for High Voltage Applications Public/Granted day:2009-07-16
Information query
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