Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US12419150Application Date: 2009-04-06
-
Publication No.: US08018001B2Publication Date: 2011-09-13
- Inventor: Seiji Otake
- Applicant: Seiji Otake
- Applicant Address: US AZ Phoenix JP Ora-gun
- Assignee: Semiconductor Components Industries, LLC,Sanyo Semiconductor Co., Ltd.
- Current Assignee: Semiconductor Components Industries, LLC,Sanyo Semiconductor Co., Ltd.
- Current Assignee Address: US AZ Phoenix JP Ora-gun
- Agency: Morrison & Foerster LLP
- Priority: JP2008-099929 20080408
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
A breakdown voltage of a clamp diode can be reduced while a leakage current is suppressed. A P− type diffusion layer is formed in a surface of an N− type semiconductor layer. An N+ type diffusion layer is formed in a surface of the P− type diffusion layer. A P+ type diffusion layer is formed adjacent the N+ type diffusion layer in the surface of the P− type diffusion layer. An N+ type diffusion layer is formed adjacent the P− type diffusion layer in the surface of the N− type semiconductor layer. There is formed a cathode electrode, which is electrically connected with the N+ type diffusion layer through a contact hole formed in an insulation film on the N+ type diffusion layer. There is formed a wiring (an anode electrode) connecting between the P+ type diffusion layer and the N+ type diffusion layer through a contact hole formed in the insulation film on the P+ type diffusion layer and a contact hole formed in the insulation film on the N+ type diffusion layer.
Public/Granted literature
- US20090250759A1 SEMICONDUCTOR DEVICE Public/Granted day:2009-10-08
Information query
IPC分类: