Invention Grant
US08018010B2 Circular surface acoustic wave (SAW) devices, processes for making them, and methods of use
有权
圆形表面声波(SAW)器件,制造它们的方法和使用方法
- Patent Title: Circular surface acoustic wave (SAW) devices, processes for making them, and methods of use
- Patent Title (中): 圆形表面声波(SAW)器件,制造它们的方法和使用方法
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Application No.: US12166646Application Date: 2008-07-02
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Publication No.: US08018010B2Publication Date: 2011-09-13
- Inventor: Onur Tigli , Mona Zaghloul
- Applicant: Onur Tigli , Mona Zaghloul
- Applicant Address: US DC Washington
- Assignee: The George Washington University
- Current Assignee: The George Washington University
- Current Assignee Address: US DC Washington
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Main IPC: H01L29/68
- IPC: H01L29/68

Abstract:
The design, fabrication, post-processing and characterization of a novel circular design SAW (Surface Acoustic Wave) based bio/chemical sensor in CMOS technology is introduced. The sensors are designed in AMI 1.5 μm 2 metal, 2 poly process. A unique maskless post processing sequence is designed and completed. The three post-processing steps are fully compatible with any CMOS technology. This allows any signal control/processing circuitry to be easily integrated on the same chip. ZnO is used as the piezoelectric material for the SAW generation. A thorough characterization and patterning optimization of the sputtered ZnO was carried out. The major novelties that are introduced in the SAW delay line features are: The embedded heater elements for temperature control, compensation and acoustic absorbers that are designed to eliminate edge reflections and minimize triple transit interference. Both of these attributes are designed by using the CMOS layers without disturbing the SAW performance.
Public/Granted literature
- US20090114798A1 Circular Surface Acoustic Wave (SAW) Devices, Processes for Making Them, and Methods of Use Public/Granted day:2009-05-07
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