Invention Grant
- Patent Title: Schottky diode and method of fabricating the same
- Patent Title (中): 肖特基二极管及其制造方法
-
Application No.: US12662452Application Date: 2010-04-19
-
Publication No.: US08018021B2Publication Date: 2011-09-13
- Inventor: Dae-Shik Kim , Oh-Kyum Kwon , Myung-Hee Kim , Yong-Chan Kim , Hye-Young Park , Joon-Suk Oh
- Applicant: Dae-Shik Kim , Oh-Kyum Kwon , Myung-Hee Kim , Yong-Chan Kim , Hye-Young Park , Joon-Suk Oh
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Main IPC: H01L29/872
- IPC: H01L29/872

Abstract:
A schottky diode may include a schottky junction including a well formed in a semiconductor substrate and a first electrode contacting the first well. The well may have a first conductivity type. A first ohmic junction may include a first junction region formed in the well and a second electrode contacting the first junction region. The first junction region may have a higher concentration of the first conductivity type than the well. A first device isolation region may be formed in the semiconductor substrate separating the schottky junction and the first ohmic junction. A well guard having a second conductivity type opposite to the first conductivity type may be formed in the well. At least a portion of the well guard may be formed under a portion of the schottky junction.
Public/Granted literature
- US20100200945A1 Schottky diode and method of fabricating the same Public/Granted day:2010-08-12
Information query
IPC分类: