Invention Grant
US08018024B2 P-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse 有权
P-i-n二极管与硅化物结晶,与绝缘反熔丝串联

  • Patent Title: P-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse
  • Patent Title (中): P-i-n二极管与硅化物结晶,与绝缘反熔丝串联
  • Application No.: US11560289
    Application Date: 2006-11-15
  • Publication No.: US08018024B2
    Publication Date: 2011-09-13
  • Inventor: S. Brad Herner
  • Applicant: S. Brad Herner
  • Applicant Address: US CA Milpitas
  • Assignee: SanDisk 3D LLC
  • Current Assignee: SanDisk 3D LLC
  • Current Assignee Address: US CA Milpitas
  • Agency: Dugan & Dugan, PC
  • Main IPC: H01L29/00
  • IPC: H01L29/00
P-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse
Abstract:
A method is described for forming a nonvolatile one-time-programmable memory cell having reduced programming voltage. A contiguous p-i-n diode is paired with a dielectric rupture antifuse formed of a high-dielectric-constant material, having a dielectric constant greater than about 8. In preferred embodiments, the high-dielectric-constant material is formed by atomic layer deposition. The diode is preferably formed of deposited low-defect semiconductor material, crystallized in contact with a silicide. A monolithic three dimensional memory array of such cells can be formed in stacked memory levels above the wafer substrate.
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