Invention Grant
US08018075B2 Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package
有权
半导体封装，用于增强接合线的接合的方法，以及用于制造半导体封装的方法
- Patent Title: Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package
- Patent Title (中): 半导体封装，用于增强接合线的接合的方法，以及用于制造半导体封装的方法
-
Application No.: US12501309Application Date: 2009-07-10
-
Publication No.: US08018075B2Publication Date: 2011-09-13
- Inventor: Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung
- Applicant: Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Priority: TW97142797A 20081106
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44
Abstract:
A wire bonding structure of a semiconductor package includes a bonding wire, a pad and a non-conductive adhesive material. The bonding wire includes a line portion and a block portion, wherein the block portion is physically connected to the line portion, and the sectional area of the block portion is bigger than that of the line portion. The pad is bonded to the block portion. The non-conductive adhesive material covers the pad and seals the whole block portion of the bonding wire.
Public/Granted literature
Information query
IPC分类:
