Invention Grant
US08018121B1 Integrated thickness shear mode (TSM) sensor and surface acoustic wave (SAW) device for simultaneous sensing and removal of analytes 有权
集成厚度剪切模式(TSM)传感器和表面声波(SAW)装置,用于同时检测和去除分析物

  • Patent Title: Integrated thickness shear mode (TSM) sensor and surface acoustic wave (SAW) device for simultaneous sensing and removal of analytes
  • Patent Title (中): 集成厚度剪切模式(TSM)传感器和表面声波(SAW)装置,用于同时检测和去除分析物
  • Application No.: US12483456
    Application Date: 2009-06-12
  • Publication No.: US08018121B1
    Publication Date: 2011-09-13
  • Inventor: Stefan Cular
  • Applicant: Stefan Cular
  • Applicant Address: US FL Tampa
  • Assignee: University of South Florida
  • Current Assignee: University of South Florida
  • Current Assignee Address: US FL Tampa
  • Agency: Smith & Hopen, P.A.
  • Agent Courtney M. Dunn
  • Main IPC: H01L41/08
  • IPC: H01L41/08
Integrated thickness shear mode (TSM) sensor and surface acoustic wave (SAW) device for simultaneous sensing and removal of analytes
Abstract:
Provided is a sensor which integrates a pair of substantially unidirectional surface acoustic wave (SAW) interdigital transducers (IDTs) and a thickness shear mode (TSM) electrode. The sensor provides simultaneous sensing and removal of material from the sensor's surface. The sensing aspect is accomplished through the use of the TSM electrode that is designed to operate between 2 and 100 MHz. The removal of material is accomplished using substantially unidirectional IDTs aligned on the substrate to produce acoustic waves, such as Rayleigh waves, across the entire TSM sensor active area. When liquid is added over the acoustic waves, acoustic streaming occurs, which dislodges material from the sensor's surface. The acoustic waves are designed to operate at a significantly different frequency than the sensor to prevent interference between the two.
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