Invention Grant
- Patent Title: Surface acoustic wave device, module device, oscillation circuit, and method for manufacturing surface acoustic wave device
- Patent Title (中): 声表面波装置，模块装置，振荡电路及制造声表面波装置的方法
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Application No.: US12905642Application Date: 2010-10-15
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Publication No.: US08018122B2Publication Date: 2011-09-13
- Inventor: Takuya Owaki , Yuji Mitsui , Yuzuru Yoshizawa
- Applicant: Takuya Owaki , Yuji Mitsui , Yuzuru Yoshizawa
- Applicant Address: JP Tokyo
- Assignee: Epson Toyocom Corporation
- Current Assignee: Epson Toyocom Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-288987 20050930; JP2006-228768 20060825
- Main IPC: H03H9/25
- IPC: H03H9/25
Abstract:
An SH wave type surface acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate and constituted of Al or an alloy mainly containing Al and that uses a SH wave as an excitation wave. The piezoelectric substrate is a crystal plate in which a cut angle θ of a rotary Y cut quartz substrate is set in a range of −64.0°
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