Invention Grant
- Patent Title: Structure and method for flex circuit on a chip
- Patent Title (中): 芯片上柔性电路的结构和方法
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Application No.: US12765040Application Date: 2010-04-22
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Publication No.: US08018229B1Publication Date: 2011-09-13
- Inventor: Robert D. Horning , Jeff A. Ridley , Bharat Pant
- Applicant: Robert D. Horning , Jeff A. Ridley , Bharat Pant
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Fogg & Powers LLC
- Main IPC: G01R33/02
- IPC: G01R33/02

Abstract:
A method of fabricating a multi-axis sensor is provided. The method includes forming patterns of sacrificial material overlaying a substrate and overlaying a flexible material on the sacrificial material and an anchor-surface of the substrate. The flexible material includes sensor-regions, an anchor-region, and at least one hinge-region. The method further includes forming sensor elements from orientable sensor material overlaying respective sensor-regions of the flexible material; forming at least one respective anchor-hinge in the flexible material along the boundary between the anchor-region and an adjacent sensor region; forming the sensor-regions, the anchor-region, and the at least one hinge-region in the flexible material; training the sensor elements to form respective oriented-sensor elements that are oriented in the same direction; etching the sacrificial material; and etching the substrate at an angle from the anchor-surface.
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