Invention Grant
- Patent Title: Resistive component and method of manufacturing the same
- Patent Title (中): 电阻元件及其制造方法
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Application No.: US12482948Application Date: 2009-06-11
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Publication No.: US08018318B2Publication Date: 2011-09-13
- Inventor: Chung-Hsiung Wang , Hideo Ikuta , Wu-Liang Chu , Yen-Ting Lin , Chih Sheng Kuo , Wen-Hsiung Liao
- Applicant: Chung-Hsiung Wang , Hideo Ikuta , Wu-Liang Chu , Yen-Ting Lin , Chih Sheng Kuo , Wen-Hsiung Liao
- Applicant Address: TW Hsin-chu
- Assignee: Cyntec Co., Ltd.
- Current Assignee: Cyntec Co., Ltd.
- Current Assignee Address: TW Hsin-chu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW97130754A 20080813
- Main IPC: H01C7/18
- IPC: H01C7/18

Abstract:
A resistive component suitable for detecting electric current in a circuit and a method of manufacturing the resistive component are provided. The resistive component includes a carrier, a resistive layer, an electrode unit, an upper oxide layer and a protective layer. The resistive layer comprises copper alloy and is disposed on the carrier. The electrode unit is electrically connected to the resistive layer. The upper oxide layer is disposed on a part of a surface of the resistive layer and includes oxides of the resistive layer. The protective layer covers at least a part of the upper oxide layer.
Public/Granted literature
- US20100039211A1 RESISTIVE COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-02-18
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