Invention Grant
- Patent Title: Solid electrolytic capacitor having dual cathode plates surrounded by an anode body and a plurality of through holes
- Patent Title (中): 具有由阳极体和多个通孔包围的双阴极板的固体电解电容器
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Application No.: US12148250Application Date: 2008-04-17
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Publication No.: US08018713B2Publication Date: 2011-09-13
- Inventor: Yuji Yoshida , Katsuhiro Yoshida , Takeo Kasuga , Masanori Takahashi , Takeshi Saito , Koji Sakata
- Applicant: Yuji Yoshida , Katsuhiro Yoshida , Takeo Kasuga , Masanori Takahashi , Takeshi Saito , Koji Sakata
- Applicant Address: JP Sendai-Shi
- Assignee: NEC Tokin Corporation
- Current Assignee: NEC Tokin Corporation
- Current Assignee Address: JP Sendai-Shi
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2007-110317 20070419
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G9/042 ; H01G9/045

Abstract:
Anodized films are formed at both surfaces of an aluminum base and, at the center portion on each side of the aluminum base, a solid electrolyte layer of a conductive polymer, a graphite layer, and a metal layer are stacked in the order, thereby forming a rectangular cathode portion. An insulator layer is formed at the peripheries of four sides of the cathode portion and, further, an anode lead frame is provided at the peripheries of four sides of the upper insulator layer, thereby forming an anode portion. Openings are formed at four corners of the insulator layer or the anode portion, thereby establishing electrical connection between the cathode portions on both sides of the aluminum base. By setting the ratio of a total region, occupied by the openings, of the cathode portion to 25% or less, the ESL of a capacitor can be suppressed low even when the openings are provided.
Public/Granted literature
- US20080259526A1 Solid electrolytic capacitor Public/Granted day:2008-10-23
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