Invention Grant
- Patent Title: Apparatus for shielding integrated circuit devices
- Patent Title (中): 集成电路器件屏蔽装置
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Application No.: US12719123Application Date: 2010-03-08
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Publication No.: US08018739B2Publication Date: 2011-09-13
- Inventor: Janet Patterson
- Applicant: Janet Patterson
- Applicant Address: US CA San Diego
- Assignee: Maxwell Technologies, LLC
- Current Assignee: Maxwell Technologies, LLC
- Current Assignee Address: US CA San Diego
- Agency: Oppedahl Patent Law Firm LLC
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
A high reliability radiation shielding integrated circuit apparatus comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose of tolerance of the circuit die. In one embodiment, an integrated circuit apparatus for use in high reliability applications is disclosed. The integrated circuit apparatus is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.
Public/Granted literature
- US20100155912A1 APPARATUS FOR SHIELDING INTEGRATED CIRCUIT DEVICES Public/Granted day:2010-06-24
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