Invention Grant
- Patent Title: Speaker system
- Patent Title (中): 扬声器系统
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Application No.: US11544247Application Date: 2006-10-06
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Publication No.: US08019108B2Publication Date: 2011-09-13
- Inventor: Toyofumi Hayashi
- Applicant: Toyofumi Hayashi
- Applicant Address: JP Hamamatsu-shi
- Assignee: Yamaha Corporation
- Current Assignee: Yamaha Corporation
- Current Assignee Address: JP Hamamatsu-shi
- Agency: Morrison & Foerster LLP
- Priority: JP2005-294481 20051007
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A loudspeaker system includes a speaker enclosure that includes a plurality of faces which surround so as to have an internal space tightly closed, a cut-away portion that is cut away along a contour of a virtual plane figure surrounded by a line on one face of the speaker enclosure while a part of the contour as a connection portion is left, a sealing member that covers the cut-away portion so as to tightly seal the internal space of the speaker enclosure, and a loudspeaker that is provided on any face of the speaker enclosure. A portion of the face surrounded by the cut-away portion is a diaphragm capable of vibrating due to bending elasticity while a near portion of the connection portion serves as a point of support. The sealing member is attached to the diaphragm and a peripheral portion which includes a portion of the one face surrounding the diaphragm so as to tightly seal the internal space of the speaker enclosure in a state that the diaphragm can vibrate.
Public/Granted literature
- US20070081687A1 Speaker system Public/Granted day:2007-04-12
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