An improved headphone support assembly comprises a hook-shaped member for positioning over the ear of a user. The assembly comprises a clip or series of clips for releasably retaining a headphone wire, and disposes the wire at one terminal end of the hook-shaped member adjacent the auditory canal of a user. An ‘earbud’ type headphone wire is affixed to the member, with a predetermined amount of slack between the member and the headphone speaker to allow the speaker to move independently of the member. An adjustable arm attached to the lower portion of the hook-shaped member, and connected by a hinge, extends under the ear lobe of a user, and articulates to accommodate a variety of ear sizes.