Invention Grant
- Patent Title: Wired circuit board and electronic device
- Patent Title (中): 有线电路板和电子设备
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Application No.: US11902553Application Date: 2007-09-24
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Publication No.: US08022308B2Publication Date: 2011-09-20
- Inventor: Szu-Han Hu , Voon Yee Ho , Hiroshi Yamazaki , Martin John McCaslin
- Applicant: Szu-Han Hu , Voon Yee Ho , Hiroshi Yamazaki , Martin John McCaslin
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2006-271035 20061002
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
Public/Granted literature
- US20080078573A1 Wired circuit board and electronic device Public/Granted day:2008-04-03
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