Invention Grant
- Patent Title: Solder composition for electronic devices
- Patent Title (中): 电子器件用焊料组成
-
Application No.: US11399856Application Date: 2006-04-07
-
Publication No.: US08022551B2Publication Date: 2011-09-20
- Inventor: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
- Applicant: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
- Applicant Address: JP Kawasaki
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2000-180719 20000612; JP2000-396905 20001225
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
Public/Granted literature
- US20070031279A1 Solder composition for electronic devices Public/Granted day:2007-02-08
Information query
IPC分类:
