Invention Grant
US08024942B2 Method and apparatus for highly efficient compact vapor compression cooling
有权
用于高效紧凑蒸气压缩冷却的方法和装置
- Patent Title: Method and apparatus for highly efficient compact vapor compression cooling
- Patent Title (中): 用于高效紧凑蒸气压缩冷却的方法和装置
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Application No.: US11963669Application Date: 2007-12-21
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Publication No.: US08024942B2Publication Date: 2011-09-27
- Inventor: Daniel P. Rini , Louis Chow , H. Randolph Anderson , Jayanta Sankar Kapat , Bradley Carman , Brian Gulliver , Jose Mauricio Recio
- Applicant: Daniel P. Rini , Louis Chow , H. Randolph Anderson , Jayanta Sankar Kapat , Bradley Carman , Brian Gulliver , Jose Mauricio Recio
- Applicant Address: US FL Oviedo
- Assignee: Rini Technologies, Inc.
- Current Assignee: Rini Technologies, Inc.
- Current Assignee Address: US FL Oviedo
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Main IPC: F25B39/04
- IPC: F25B39/04

Abstract:
The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface. In another specific embodiment, the heat transfer surface can incorporate surface enhancements which enhance the transfer of heat from the heat transfer surface to the external fluid. In another specific embodiment, an outer layer can be positioned above the heat transfer surface to create a volume between the heat transfer surface and the outer layer through which the external fluid can flow.
Public/Granted literature
- US20100293993A1 Method and Apparatus for Highly Efficient Compact Vapor Compression Cooling Public/Granted day:2010-11-25
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