Invention Grant
US08026133B2 Method of fabricating a semiconductor device with a non-uniform gate insulating film
失效
制造具有不均匀栅极绝缘膜的半导体器件的方法
- Patent Title: Method of fabricating a semiconductor device with a non-uniform gate insulating film
- Patent Title (中): 制造具有不均匀栅极绝缘膜的半导体器件的方法
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Application No.: US12457892Application Date: 2009-06-24
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Publication No.: US08026133B2Publication Date: 2011-09-27
- Inventor: Yoshio Ozawa , Isao Kamioka
- Applicant: Yoshio Ozawa , Isao Kamioka
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2005-065812 20050309
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/772

Abstract:
A semiconductor device includes a semiconductor substrate, a gate insulating film formed on the semiconductor substrate, a gate electrode formed on the gate insulating film, a source/drain diffusion layer formed in the semiconductor substrate at both sides of the gate electrode, and a channel region formed in the semiconductor substrate between a source and a drain of the source/drain diffusion layer and arranged below the gate insulating film, wherein an upper surface of the source/drain diffusion layer is positioned below a bottom surface of the gate electrode, and an upper surface of the channel region is positioned below the upper surface of the source/drain diffusion layer.
Public/Granted literature
- US20090269894A1 Semiconductor device and method of fabricating the same cross-reference to related applications Public/Granted day:2009-10-29
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