Invention Grant
- Patent Title: Method for producing semiconductor device
- Patent Title (中): 半导体器件的制造方法
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Application No.: US12641079Application Date: 2009-12-17
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Publication No.: US08026155B2Publication Date: 2011-09-27
- Inventor: Takahisa Kusuura
- Applicant: Takahisa Kusuura
- Applicant Address: US DE Wilmington
- Assignee: Empire Technology Development LLC
- Current Assignee: Empire Technology Development LLC
- Current Assignee Address: US DE Wilmington
- Agency: Foley & Lardner LLP
- Priority: JP2009-023379 20090204
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36 ; H01L29/06 ; H01L31/00

Abstract:
A method for producing a semiconductor device includes forming an aluminum layer on a core substrate, anodizing the aluminum layer into an alumina layer having a plurality of nanoholes, forming an n-type GaN layer by growing crystals of a compound semiconductor such as an n-type GaN on the alumina layer and inside the nanoholes, and dissolving the alumina layer with an acid. As a result, gaps are formed and a structure in which the core substrate is joined to the n-type GaN layer through portions, other than the gaps, having a very small area is generated. Then a laser beam is applied to the n-type GaN layer through the core substrate to separate the n-type GaN layer from the core substrate by a laser lift-off technique.
Public/Granted literature
- US20100193913A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE Public/Granted day:2010-08-05
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