Invention Grant
- Patent Title: Method and apparatus for manufacturing superconducting tape through integrated process
- Patent Title (中): 通过综合工艺制造超导带的方法和装置
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Application No.: US11863251Application Date: 2007-09-28
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Publication No.: US08026197B2Publication Date: 2011-09-27
- Inventor: Ho Seop Kim , Sang Soo Oh , Hong Soo Ha , Kyu Jung Song , Dong Woo Ha , Rock Kil Ko
- Applicant: Ho Seop Kim , Sang Soo Oh , Hong Soo Ha , Kyu Jung Song , Dong Woo Ha , Rock Kil Ko
- Applicant Address: KR
- Assignee: Korea Electrotechnology Research Institute
- Current Assignee: Korea Electrotechnology Research Institute
- Current Assignee Address: KR
- Agency: Park & Associates IP Law, P.C.
- Priority: KR10-2007-0023420 20070309
- Main IPC: H01L39/24
- IPC: H01L39/24 ; H01L39/02 ; B32B15/04 ; B05D5/12 ; C09J5/02

Abstract:
A method and apparatus for manufacturing superconducting tape through an integrated process, including the steps of: heat-treating a substrate wound on a drum in a reaction chamber; continuously depositing components, constituting a buffer layer, a superconducting layer, a contact resistance layer, and a protective layer of the superconducting tape, which are supplied from a deposition chamber, on the substrate; and heat-treating the substrate deposited with the components. The present invention is advantageous in that the unit cost and time for manufacturing a superconducting tape are decreased because all processes for manufacturing a superconducting tape can be performed under the same conditions, the uniformity and performance of a superconducting tape is improved because the same deposition conditions are applied to all of the process for manufacturing a superconducting tape, and a high-quality superconducting tape having high deposition efficiency can be obtained because specific components can be deposited on a large-sized substrate using a drum.
Public/Granted literature
- US20080220976A1 Method And Apparatus For Manufacturing Superconducting Tape Through Integrated Process Public/Granted day:2008-09-11
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