Invention Grant
US08026310B2 Coating powder of epoxy resin, styrene-maleimide curing agent and a second curing agent
有权
环氧树脂涂料粉末,苯乙烯 - 马来酰亚胺固化剂和第二固化剂
- Patent Title: Coating powder of epoxy resin, styrene-maleimide curing agent and a second curing agent
- Patent Title (中): 环氧树脂涂料粉末,苯乙烯 - 马来酰亚胺固化剂和第二固化剂
-
Application No.: US12214810Application Date: 2008-06-23
-
Publication No.: US08026310B2Publication Date: 2011-09-27
- Inventor: Jeno Muthiah
- Applicant: Jeno Muthiah
- Applicant Address: US IL Addison
- Assignee: Alpha Coating Technologies, Inc
- Current Assignee: Alpha Coating Technologies, Inc
- Current Assignee Address: US IL Addison
- Agent Gerald K. White
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L63/02 ; C08L63/04

Abstract:
A low temperature curable coating powder comprising an epoxy functional resin is cured with styrene maleimide in combination with at least one other curing agent such as dicyandiamide, imidazole, or an imidazole adduct. The combination of three curing agents such styrene maleimide, dicyandiamide, and an imidazole or imidazole adduct is useful for achieving gloss control. The coating powder may be curable at temperatures of 300° F. or lower. The coating of heat-sensitive and non-conductive substrates is facilitated with use of such coating powder, although other substrates, such as metal may be coated in accordance with the invention.
Public/Granted literature
- US20080269430A1 Low temperature curing coating powder Public/Granted day:2008-10-30
Information query