Invention Grant
- Patent Title: Curable polymer composition
- Patent Title (中): 可固化的聚合物组成
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Application No.: US12514935Application Date: 2007-12-06
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Publication No.: US08026313B2Publication Date: 2011-09-27
- Inventor: Katsuhiko Imoto , Tetsuo Shimizu , Masayuki Hayashi , Tomohiro Iimura , Eiji Kitaura , Peter Cheshire Hupfield
- Applicant: Katsuhiko Imoto , Tetsuo Shimizu , Masayuki Hayashi , Tomohiro Iimura , Eiji Kitaura , Peter Cheshire Hupfield
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-332198 20061208
- International Application: PCT/JP2007/074066 WO 20071206
- International Announcement: WO2008/072716 WO 20080619
- Main IPC: C08L9/00
- IPC: C08L9/00 ; C08L27/12 ; C08L29/00 ; C08L31/00 ; C08L33/02 ; C08L33/04 ; C08L35/02 ; C08L45/00

Abstract:
A curable polymer composition that is quickly curable to form a cured article having excellent adhesion and followability to a substrate and at least including (A) an acrylic copolymer having a hydrogen atom bonded to a silicon atom, (B) a compound having at least two aliphatic unsaturated bonds in one molecule thereof, (C) a fluoroolefin copolymer including vinylidene fluoride as main component, and (D) a catalyst for hydrosilylation reaction.
Public/Granted literature
- US20100076158A1 CURABLE POLYMER COMPOSITION Public/Granted day:2010-03-25
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